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250-0587-00

Part number 250-0587-00
Product classification Sensor Evaluation Boards
Manufacturer Teledyne FLIR
Description LEPTON BREAKOUT BOARD PCB ASSY
Encapsulation
Packing Box
Quantity 0
RoHS status YES
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Product parameters
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TYPEDESCRIPTION
MfrTeledyne FLIR
SeriesLepton®
PackageBox
Product StatusOBSOLETE
InterfaceI2C, Serial, SPI
Voltage - Supply3V ~ 5.5V
Sensor TypeThermal Imaging, Infrared (IR)
Utilized IC / PartLepton® Camera Modules
Supplied ContentsBoard(s)

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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