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HDG200-DN-3

Part number HDG200-DN-3
Product classification RF Transceiver ICs
Manufacturer H&D Wireless
Description IC RF TXRX+MCU WIFI 44TQFN
Encapsulation
Packing Tray
Quantity 80
RoHS status YES
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Inventory:
Total number

Quantity

Price

Total price

1

$42.8280

$42.8280

10

$39.5280

$395.2800

25

$36.2400

$906.0000

80

$33.4920

$2,679.3600

230

$31.8480

$7,325.0400

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Product parameters
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TYPEDESCRIPTION
MfrH&D Wireless
Series-
PackageTray
Product StatusACTIVE
Package / Case44-TQFN Exposed Pad Module
Mounting TypeSurface Mount
Frequency2.4GHz
Memory Size1kB EEPROM, 160kB SRAM
TypeTxRx + MCU
Operating Temperature-40°C ~ 85°C
Voltage - Supply2.75V ~ 3.6V
Power - Output17dBm
Protocol802.11b/g/n
Current - Receiving49mA
Data Rate (Max)72.2Mbps
Current - Transmitting197mA
Supplier Device Package44-QFN SIP (8x8)
RF Family/StandardWiFi
Serial InterfacesSDIO, SPI
DigiKey ProgrammableNot Verified

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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