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IDP-108-D-02-T-LF

Part number IDP-108-D-02-T-LF
Product classification Board In, Direct Wire to Board
Manufacturer Major League Electronics
Description .100 IDC
Encapsulation
Packing Bag
Quantity 144
RoHS status YES
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$0.7920

$0.7920

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TYPEDESCRIPTION
MfrMajor League Electronics
SeriesIDP-1
PackageBag
Product StatusACTIVE
FeaturesClosed End
Connector TypeRibbon Cable, DIP Header
Contact FinishTin
ColorBlack
Mounting TypeThrough Hole
Number of Positions16
Row Spacing0.100" (2.54mm)
Number of Positions LoadedAll
Cable TerminationIDC
Cable Pitch0.100" (2.54mm)
Board-Side Pitch0.100" (2.54mm)
Number of Rows2

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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