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MSDV-2108-BK33T

Part number MSDV-2108-BK33T
Product classification PC Card Sockets
Manufacturer ACES GROUP
Description MICRO SD CARD CONN. VERTICAL DIP
Encapsulation
Packing Tray
Quantity 4026
RoHS status YES
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Inventory:
Total number

Quantity

Price

Total price

1

$3.6360

$3.6360

10

$3.3000

$33.0000

25

$3.1320

$78.3000

40

$3.0600

$122.4000

80

$2.9040

$232.3200

230

$2.5440

$585.1200

440

$2.4720

$1,087.6800

945

$2.1120

$1,995.8400

2400

$1.9680

$4,723.2000

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Product parameters
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TYPEDESCRIPTION
MfrACES GROUP
Series-
PackageTray
Product StatusACTIVE
Connector TypeConnector and Ejector
Contact FinishGold
Mounting TypeThrough Hole
Number of Positions8
Card TypemicroSD™
Height Above Board0.835" (21.20mm)
Contact Finish Thickness5.00µin (0.127µm)
Mounting FeatureNormal, Standard - Top
Insertion, Removal MethodPush In, Pull Out

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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