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PC581/330

Part number PC581/330
Product classification Bobbins (Coil Formers), Mounts, Hardware
Manufacturer Lodestone Pacific
Description COVER CUP FOR STM582-8
Encapsulation
Packing Bag
Quantity 475
RoHS status YES
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Inventory:
Total number

Quantity

Price

Total price

25

$0.4680

$11.7000

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Product parameters
TYPEDESCRIPTION
MfrLodestone Pacific
Series-
PackageBag
Product StatusACTIVE
For Use With/Related ProductsToroids
Accessory TypeHousing

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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