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RP605Z363B-E2-F

Part number RP605Z363B-E2-F
Product classification Power Management - Specialized
Manufacturer RICOH/Nisshinbo Micro Devices
Description 300MA ULTRA-LOW POWER BUCK BOOST
Encapsulation
Packing Tape & Reel (TR)
Quantity 4250
RoHS status YES
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Inventory:
Total number

Quantity

Price

Total price

1

$2.8920

$2.8920

10

$2.6040

$26.0400

25

$2.4600

$61.5000

100

$2.0880

$208.8000

250

$1.9680

$492.0000

500

$1.7160

$858.0000

1000

$1.4280

$1,428.0000

2500

$1.3200

$3,300.0000

5000

$1.2720

$6,360.0000

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Product parameters
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TYPEDESCRIPTION
MfrRICOH/Nisshinbo Micro Devices
SeriesRP605x
PackageTape & Reel (TR)
Product StatusACTIVE
Package / Case20-XFBGA, WLCSP
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 85°C (TA)
Voltage - Supply1.8V ~ 5.5V
ApplicationsBattery Management, Power Supplies
Current - Supply300nA
Supplier Device Package20-WLCSP-P3 (2.32x1.71)

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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